Medicept - Bond Plus SE Bonding

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  • 4003
  • Out stock
  • Free

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Current plan: 3Month

Description: 30+3

Down payment: تومان162,500 (25.00%)

Number of payments: 3

Tax: تومان0

Amount of payment: تومان169,000

Overpayment: تومان19,500

Total: تومان669,500

Current plan: Cash

Description: نقدی

Down payment: تومان0 (0.00%)

Number of payments: 1

Tax: تومان0

Amount of payment: تومان650,000

Overpayment: تومان0

Total: تومان650,000

Description

bonding

Medicept Bond PlusSE

7th generation

  • Simplified ultra-efficient bonding system based on proven ethanol/water solvent technology:
  • Total etch, less technique sensitive.
  • Ideal for wet or dry bonding.
  • Reduced post-operative sensitivity.
  • Filler Loaded: Reduced micro-leakage.
  • Reduced film thickness.
  • Increased bond strength.
  • One bottle for ultimate simplicity of use: Time saving.
  • For direct & indirect applications.
  • Reliable: clinically proven.

   

5ml bottle



Reference : 4003

Data sheet

  • Medicept
  • Denmark

Specific References

New product



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Medicept - Bond Plus SE Bonding

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